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Architecture for on-die interconnect

United States Patent

9,287,208
March 15, 2016
View the Complete Patent at the US Patent & Trademark Office
In an embodiment, an apparatus includes: a plurality of islands configured on a semiconductor die, each of the plurality of islands having a plurality of cores; and a plurality of network switches configured on the semiconductor die and each associated with one of the plurality of islands, where each network switch includes a plurality of output ports, a first set of the output ports are each to couple to the associated network switch of an island via a point-to-point interconnect and a second set of the output ports are each to couple to the associated network switches of a plurality of islands via a point-to-multipoint interconnect. Other embodiments are described and claimed.
Khare; Surhud (Bangalore, IN), More; Ankit (Hillsboro, OR), Somasekhar; Dinesh (Portland, OR), Dunning; David S. (Portland, OR)
Intel Corporation (Santa Clara, CA)
14/ 524,622
October 27, 2014
This invention was made with government support under contract number B600738 awarded by Department of Energy. The government has certain rights in the invention.