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Data center thermal management

United States Patent

9,258,932
February 9, 2016
View the Complete Patent at the US Patent & Trademark Office
Historical high-spatial-resolution temperature data and dynamic temperature sensor measurement data may be used to predict temperature. A first formulation may be derived based on the historical high-spatial-resolution temperature data for determining a temperature at any point in 3-dimensional space. The dynamic temperature sensor measurement data may be calibrated based on the historical high-spatial-resolution temperature data at a corresponding historical time. Sensor temperature data at a plurality of sensor locations may be predicted for a future time based on the calibrated dynamic temperature sensor measurement data. A three-dimensional temperature spatial distribution associated with the future time may be generated based on the forecasted sensor temperature data and the first formulation. The three-dimensional temperature spatial distribution associated with the future time may be projected to a two-dimensional temperature distribution, and temperature in the future time for a selected space location may be forecasted dynamically based on said two-dimensional temperature distribution.
Hamann; Hendrik F. (Yorktown Heights, NY), Li; Hongfei (Briarcliff Manor, NY)
International Business Machines Corporation (Armonk, NY)
13/ 336,266
20130166241
December 23, 2011
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under Contract No.: DE-EE00002897 awarded by Department of Energy. The Government has certain rights in this invention.