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Non-permeable substrate carrier for electroplating

United States Patent

December 29, 2015
View the Complete Patent at the US Patent & Trademark Office
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
Abas; Emmanuel Chua (Laguna, PH), Chen; Chen-An (Milpitas, CA), Ma; Diana Xiaobing (Saratoga, CA), Ganti; Kalyana Bhargava (Fremont, CA), Divino; Edmundo Anida (Cavite, PH), Ermita; Jake Randal G. (Laguna, PH), Capulong; Jose Francisco S. (Laguna, PH), Castillo; Arnold Villamor (Batangas, PH)
SunPower Corporation (San Jose, CA)
13/ 661,966
October 26, 2012
STATEMENT OF FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The invention described herein was made with Governmental support under contract number DE-FC36-07GO17043 awarded by the United States Department of Energy. The Government may have certain rights in the invention.