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Environmentally-assisted technique for transferring devices onto non-conventional substrates

United States Patent

August 26, 2014
View the Complete Patent at the US Patent & Trademark Office
A device fabrication method includes: (1) providing a growth substrate including a base and an oxide layer disposed over the base; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.
Lee; Chi-Hwan (Stanford, CA), Kim; Dong Rip (Stanford, CA), Zheng; Xiaolin (Stanford, CA)
Board of Trustess of the Leland Stanford Junior University (Palo Alto, CA)
13/ 791,214
March 8, 2013
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under contract 0826003 awarded by the National Science Foundation and under contract DE-SC0001060 awarded by the Department of Energy. The Government has certain rights in this invention.