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Vertical group III-V nanowires on si, heterostructures, flexible arrays and fabrication

United States Patent

January 13, 2015
View the Complete Patent at the US Patent & Trademark Office
Embodiments of the invention provide a method for direct heteroepitaxial growth of vertical III-V semiconductor nanowires on a silicon substrate. The silicon substrate is etched to substantially completely remove native oxide. It is promptly placed in a reaction chamber. The substrate is heated and maintained at a growth temperature. Group III-V precursors are flowed for a growth time. Preferred embodiment vertical Group III-V nanowires on silicon have a core-shell structure, which provides a radial homojunction or heterojunction. A doped nanowire core is surrounded by a shell with complementary doping. Such can provide high optical absorption due to the long optical path in the axial direction of the vertical nanowires, while reducing considerably the distance over which carriers must diffuse before being collected in the radial direction. Alloy composition can also be varied. Radial and axial homojunctions and heterojunctions can be realized. Embodiments provide for flexible Group III-V nanowire structures. An array of Group III-V nanowire structures is embedded in polymer. A fabrication method forms the vertical nanowires on a substrate, e.g., a silicon substrate. Preferably, the nanowires are formed by the preferred methods for fabrication of Group III-V nanowires on silicon. Devices can be formed with core/shell and core/multi-shell nanowires and the devices are released from the substrate upon which the nanowires were formed to create a flexible structure that includes an array of vertical nanowires embedded in polymer.
Wang; Deli (San Diego, CA), Soci; Cesare (Singapore, SG), Bao; Xinyu (Mountain View, CA), Wei; Wei (Pasadena, CA), Jing; Yi (La Jolla, CA), Sun; Ke (La Jolla, CA)
The Regents of the University of California (Oakland, CA)
13/ 126,381
October 28, 2009
STATEMENT OF GOVERNMENT INTEREST This invention was made with government support under grant no. DE-FG36-08GO018016 awarded by Department of Energy and under grant no. ECS0506902 awarded by the National Science Foundation. The government has certain rights in the invention.