A laser material processing system and method are provided. A further aspect of the present invention employs a laser for micromachining. In another aspect of the present invention, the system uses a hollow waveguide. In another aspect of the present invention, a laser beam pulse is given broad bandwidth for workpiece modification.
STATEMENT OF GOVERNMENT INTEREST
This invention was made with Government support under Contract No. DE-FG02-01ER15143 awarded by the U.S. Department of Energy. The Government has certain rights in this invention.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a 371 U.S. National Stage of International Application No. PCT/US2007/008878, filed Apr. 9, 2007. This application claims the benefit of U.S. Provisional Application No. 60/790,695, filed Apr. 10, 2006. The disclosures of the above applications are incorporated herein by reference.