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Laser material processing system

United States Patent

April 28, 2015
View the Complete Patent at the US Patent & Trademark Office
A laser material processing system and method are provided. A further aspect of the present invention employs a laser for micromachining. In another aspect of the present invention, the system uses a hollow waveguide. In another aspect of the present invention, a laser beam pulse is given broad bandwidth for workpiece modification.
Dantus; Marcos (Okemos, MI)
Board of Trustees of Michigan State University (East Lansing, MI)
12/ 226,152
April 9, 2007
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-FG02-01ER15143 awarded by the U.S. Department of Energy. The Government has certain rights in this invention. CROSS-REFERENCE TO RELATED APPLICATIONS This application is a 371 U.S. National Stage of International Application No. PCT/US2007/008878, filed Apr. 9, 2007. This application claims the benefit of U.S. Provisional Application No. 60/790,695, filed Apr. 10, 2006. The disclosures of the above applications are incorporated herein by reference.