A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.
STATEMENT OF GOVERNMENT RIGHTS
This invention was made with Government support under U.S. Department of Energy Cooperative Agreement No. DE-FC26-05NT42403 awarded by the U.S. Department of Energy. The Government has certain rights in this invention.