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Laser cutting system

United States Patent

March 3, 2015
View the Complete Patent at the US Patent & Trademark Office
A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.
Dougherty; Thomas J. (Waukesha, WI)
Johnson Controls--SAFT Advanced Power Solutions LLC (Wilmington, DE)
12/ 637,578
December 14, 2009
STATEMENT OF GOVERNMENT RIGHTS This invention was made with Government support under U.S. Department of Energy Cooperative Agreement No. DE-FC26-05NT42403 awarded by the U.S. Department of Energy. The Government has certain rights in this invention.