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Suppressing tin whisker growth in lead-free solders and platings

United States Patent

April 29, 2014
View the Complete Patent at the US Patent & Trademark Office
Savannah River National Laboratory - Visit the Technology Transfer Website
A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
Hoffman; Elizabeth N (Aiken, SC), Lam; Poh-Sang (Martinez, GA)
Savannah River Nuclear Solutions, LLC (Aiken, SC)
13/ 269,803
October 10, 2011
STATEMENT AS TO RIGHTS TO INVENTIONS MADE UNDER FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT This invention was made with Government support under Contract No. DE-AC09-08SR22470 awarded by the United States Department of Energy. The Government has certain rights in the invention.