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Focal plane array with modular pixel array components for scalability

United States Patent

December 9, 2014
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.
Kay; Randolph R. (Albuquerque, NM), Campbell; David V. (Tijeras, NM), Shinde; Subhash L. (Albuquerque, NM), Rienstra; Jeffrey L. (Albuquerque, NM), Serkland; Darwin K. (Albuquerque, NM), Holmes; Michael L. (Albuquerque, NM), Mani; Seethambal S. (Albuquerque, NM), Barker; Joy M. (Albuquerque, NM), Chu; Dahwey (Albuquerque, NM), Gurrieri; Thomas (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
13/ 163,909
June 20, 2011
STATEMENT OF GOVERNMENTAL INTEREST This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.