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High-precision micro/nano-scale machining system

United States Patent

August 19, 2014
View the Complete Patent at the US Patent & Trademark Office
A high precision micro/nanoscale machining system. A multi-axis movement machine provides relative movement along multiple axes between a workpiece and a tool holder. A cutting tool is disposed on a flexible cantilever held by the tool holder, the tool holder being movable to provide at least two of the axes to set the angle and distance of the cutting tool relative to the workpiece. A feedback control system uses measurement of deflection of the cantilever during cutting to maintain a desired cantilever deflection and hence a desired load on the cutting tool.
Kapoor; Shiv G. (Champaign, IL), Bourne; Keith Allen (Urbana, IL), DeVor; Richard E. (Champaign, IL)
The Board of Trustees of the University of Illinois (Urbana, IL)
12/ 877,863
September 8, 2010
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DMI-0328162 awarded by National Science Foundation and under Contract Numbers DE-FG02-07ER46453 and DE-FG02-04ER46471 awarded by the Department of Energy. The Government has certain rights in the invention.