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Full tape thickness feature conductors for EMI structures

United States Patent

June 10, 2014
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
Peterson; Kenneth A. (Albuquerque, NM), Knudson; Richard T. (Los Lunas, NM), Smith; Frank R. (Gardner, KS), Barner; Gregory (Overland Park, KS)
Sandia Corporation (Albuquerque, NM)
12/ 833,262
July 9, 2010
This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy and under Contract DE-AC04-01AL66850 between Honeywell FM&T and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.