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Surface plasmon dispersion engineering via double-metallic AU/AG layers for nitride light-emitting diodes

United States Patent

April 1, 2014
View the Complete Patent at the US Patent & Trademark Office
A double-metallic deposition process is used whereby adjacent layers of different metals are deposited on a substrate. The surface plasmon frequency of a base layer of a first metal is tuned by the surface plasmon frequency of a second layer of a second metal formed thereon. The amount of tuning is dependent upon the thickness of the metallic layers, and thus tuning can be achieved by varying the thicknesses of one or both of the metallic layers. In a preferred embodiment directed to enhanced LED technology in the green spectrum regime, a double-metallic Au/Ag layer comprising a base layer of gold (Au) followed by a second layer of silver (Ag) formed thereon is deposited on top of InGaN/GaN quantum wells (QWs) on a sapphire/GaN substrate.
Tansu; Nelson (Bethlehem, PA), Zhao; Hongping (Bethlehem, PA), Zhang; Jing (Bethlehem, PA), Liu; Guangyu (Bethlehem, PA)
Lehigh University (Bethlehem, PA)
12/ 963,117
December 8, 2010
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under US Department of Energy (DE-FC26-08NT01581) and US National Science Foundation (ECCS #0701421). The government has certain rights in the invention.