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Processes for multi-layer devices utilizing layer transfer

United States Patent

February 3, 2015
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
Microsystems Enabled Photovoltaics (MEPV)
A method includes forming a release layer over a donor substrate. A plurality of devices made of a first semiconductor material are formed over the release layer. A first dielectric layer is formed over the plurality of devices such that all exposed surfaces of the plurality of devices are covered by the first dielectric layer. The plurality of devices are chemically attached to a receiving device made of a second semiconductor material different than the first semiconductor material, the receiving device having a receiving substrate attached to a surface of the receiving device opposite the plurality of devices. The release layer is etched to release the donor substrate from the plurality of devices. A second dielectric layer is applied over the plurality of devices and the receiving device to mechanically attach the plurality of devices to the receiving device.
Nielson; Gregory N. (Albuquerque, NM), Sanchez; Carlos Anthony (Belen, NM), Tauke-Pedretti; Anna (Albuquerque, NM), Kim; Bongsang (Albuquerque, NM), Cederberg; Jeffrey (Albuquerque, NM), Okandan; Murat (Edgewood, NM), Cruz-Campa; Jose Luis (Albuquerque, NM), Resnick; Paul J. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
13/ 627,425
September 26, 2012
GOVERNMENT RIGHTS This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.