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Plated lamination structures for integrated magnetic devices

United States Patent

8,754,500
June 17, 2014
View the Complete Patent at the US Patent & Trademark Office
Semiconductor integrated magnetic devices such as inductors, transformers, etc., having laminated magnetic-insulator stack structures are provided, wherein the laminated magnetic-insulator stack structures are formed using electroplating techniques. For example, an integrated laminated magnetic device includes a multilayer stack structure having alternating magnetic and insulating layers formed on a substrate, wherein each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by an insulating layer, and a local shorting structure to electrically connect each magnetic layer in the multilayer stack structure to an underlying magnetic layer in the multilayer stack structure to facilitate electroplating of the magnetic layers using an underlying conductive layer (magnetic or seed layer) in the stack as an electrical cathode/anode for each electroplated magnetic layer in the stack structure.
Webb; Bucknell C. (Ossining, NY)
International Business Machines Corporation (Armonk, NY)
13/ 597,412
20140061853
August 29, 2012
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under Contract No. DE-EE0002892 awarded by the Department of Energy. The Government has certain rights in this invention.