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Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)

United States Patent

December 16, 2014
View the Complete Patent at the US Patent & Trademark Office
Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
David; Milnes P. (Fishkill, NY), Graybill; David P. (Staatsburg, NY), Iyengar; Madhusudan K. (Foster City, CA), Kamath; Vinod (Raleigh, NC), Kochuparambil; Bejoy J. (Apex, NC), Parida; Pritish R. (Fishkill, NY), Schmidt; Roger R. (Poughkeepsie, NY), Steinke; Mark E. (Durham, NC)
International Business Machines Corporation (Armonk, NY)
13/ 527,947
June 20, 2012
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH This invention was made with Government support under Contract No. DE-EE0002894, awarded by the Department of Energy. Accordingly, the U.S. Government has certain rights in the invention.