Skip to Content
Find More Like This
Return to Search

Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices

United States Patent

9,010,405
April 21, 2015
View the Complete Patent at the US Patent & Trademark Office
FLUID-COOLED HEAT SINK WITH IMPROVED FIN AREAS AND EFFICENCIES FOR USE IN COOLING VARIOUS DEVICES
The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.
Bharathan; Desikan (Lakewood, CO), Bennion; Kevin (Littleton, CO), Kelly; Kenneth (Kailua, HI), Narumanchi; Sreekant (Littleton, CO)
U.S. Department of Energy (Washington, DC)
13/ 021,853
February 7, 2011
GOVERNMENT INTERESTS The United States Government has rights in this invention pursuant to Contract No. DE-AC36-08GO28308, between the U.S. Department of Energy (DOE) and the Alliance for Sustainable Energy.