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Reliability and performance of a system-on-a-chip by predictive wear-out based activation of functional components

United States Patent

October 1, 2013
View the Complete Patent at the US Patent & Trademark Office
A processor-implemented method for determining aging of a processing unit in a processor the method comprising: calculating an effective aging profile for the processing unit wherein the effective aging profile quantifies the effects of aging on the processing unit; combining the effective aging profile with process variation data, actual workload data and operating conditions data for the processing unit; and determining aging through an aging sensor of the processing unit using the effective aging profile, the process variation data, the actual workload data, architectural characteristics and redundancy data, and the operating conditions data for the processing unit.
Cher; Chen-Yong (Port Chester, NY), Coteus; Paul W. (Yorktown Heights, NY), Gara; Alan (Mount Kisco, NY), Kursun; Eren (Ossining, NY), Paulsen; David P. (Dodge Center, MN), Schuelke; Brian A. (Rochester, MN), Sheets, II; John E. (Zumbrota, MN), Tian; Shurong (Mount Kisco, NY)
International Business Machines Corporation (Armonk, NY)
12/ 727,967
March 19, 2010
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The present disclosure was made with the U.S. Government support under Contract No.: B554331 awarded by the U.S. Department of Energy. The U.S. Government has certain rights in this disclosure.