Skip to Content
Find More Like This
Return to Search

Metal deposition using seed layers

United States Patent

November 12, 2013
View the Complete Patent at the US Patent & Trademark Office
U.S. Department of Energy - Visit the Office of the Assistant General Counsel for Technology Transfer & Intellectual Property Website
Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.
Feng; Hsien-Ping (Watertown, MA), Chen; Gang (Carlisle, MA), Bo; Yu (Chesnut Hill, MA), Ren; Zhifeng (Newton, MA), Chen; Shuo (Newton, MA), Poudel; Bed (Newtonville, MA)
Massachusetts Institute of Technology (Cambridge, MA), The Trustees of Boston College (Chestnutt Hill, MA), GMZ Energy, Inc. (Waltham, MA)
12/ 932,372
February 24, 2011
STATEMENT REGARDING U.S. GOVERNMENT RIGHTS This invention was made with U.S. government support under Grant No. DE-FG02-08ER46516, awarded by the U.S. Department of Energy. The Government has certain rights in this invention.