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Perforation patterned electrical interconnects

United States Patent

January 28, 2014
View the Complete Patent at the US Patent & Trademark Office
U.S. Department of Energy - Visit the Office of the Assistant General Counsel for Technology Transfer & Intellectual Property Website
This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.
Frey; Jonathan (Denver, CO)
ITN Energy Systems, Inc. (Littleton, CO)
13/ 717,364
December 17, 2012
GOVERNMENT LICENSE RIGHTS This invention was made with government support under grant number DE-AR0000019 awarded by the Department of Energy. The government has certain rights in the invention.