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MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

United States Patent

December 3, 2013
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.
Chanchani; Rajen (Albuquerque, NM), Nordquist; Christopher (Albuquerque, NM), Olsson; Roy H. (Albuquerque, NM), Peterson; Tracy C. (Albuquerque, NM), Shul; Randy J. (Albuquerque, NM), Ahlers; Catalina (Albuquerque, NM), Plut; Thomas A. (Albuquerque, NM), Patrizi; Gary A. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
13/ 364,166
February 1, 2012
This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.