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Integrated three-dimensional module heat exchanger for power electronics cooling

United States Patent

September 24, 2013
View the Complete Patent at the US Patent & Trademark Office
National Renewable Energy Laboratory - Visit the NREL Technology Transfer Website
Integrated Three-Dimensional Module Heat Exchange for Power Electronics Cooling
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
Bennion; Kevin (Littleton, CO), Lustbader; Jason (Boulder, CO)
Alliance for Sustainable Energy, LLC (Golden, CO)
13/ 249,706
September 30, 2011
CONTRACTUAL ORIGIN The United States Government has rights in this disclosure under Contract No. DE-AC36-08GO28308 between the United States Department of Energy and Alliance for Sustainable Energy, LLC, the Manager and Operator of the National Renewable Energy Laboratory.