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Printed circuit board impedance matching step for microwave (millimeter wave) devices

United States Patent

October 1, 2013
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.
Pao; Hsueh-Yuan (San Jose, CA), Aguirre; Jerardo (San Diego, CA), Sargis; Paul (Livermore, CA)
Lawrence Livermore National Security, LLC. (Livermore, CA), Kyocera America, Inc. (San Diego, CA)
12/ 895,347
September 30, 2010
GOVERNMENT RIGHTS The United States Government has rights in this invention pursuant to Contract No. DE-AC52-07NA27344 between the United States Department of Energy and Lawrence Livermore National Security, LLC.