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Methods and devices for fabricating and assembling printable semiconductor elements

United States Patent

March 4, 2014
View the Complete Patent at the US Patent & Trademark Office
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Nuzzo; Ralph G. (Champaign, IL), Rogers; John A. (Champaign, IL), Menard; Etienne (Durham, NC), Lee; Keon Jae (Daejeon, KR), Khang; Dahl-Young (Urbana, IL), Sun; Yugang (Champaign, IL), Meitl; Matthew (Raleigh, NC), Zhu; Zhengtao (Urbana, IL)
The Board of Trustees of the University of Illinois (Urbana, IL)
13/ 801,868
March 13, 2013
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy under Grant No. DEFG02-91ER45439 and the Defense Advanced Projects Agency under Contract F8650-04-C-710. The United States Government has certain rights in this invention.