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Encapsulation methods and dielectric layers for organic electrical devices

United States Patent

July 2, 2013
View the Complete Patent at the US Patent & Trademark Office
The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
Blum; Yigal D. (San Jose, CA), Chu; William Siu-Keung (Newark, CA), MacQueen; David Brent (Foster City, CA), Shi; Yijian (Mountain View, CA)
SRI International (Menlo Park, CA)
13/ 202,065
March 4, 2009
ACKNOWLEDGEMENT OF GOVERNMENT SUPPORT This invention was made with Government support under a grant from the U.S. Department of Energy, grant no. DE-FC26-06NT42936. The Government has certain rights in the invention.