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Printable, flexible and stretchable diamond for thermal management

United States Patent

June 25, 2013
View the Complete Patent at the US Patent & Trademark Office
Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.
Rogers; John A. (Champaign, IL), Kim; Tae Ho (Masan, KR), Choi; Won Mook (Hwaseong, KR), Kim; Dae Hyeong (Champaign, IL), Meitl; Matthew (Raleigh, NC), Menard; Etienne (Durham, NC), Carlisle; John (Plainfield, IL)
Advanced Diamond Technologies, Inc. (Romeoville, IL), The Board of Trustees of the University of Illinois Semprius, Inc. (
12/ 418,071
April 3, 2009
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under DMI-0328162 awarded by the National Science Foundation and under DEFG02-91-ER45439 the U.S. awarded by the Department of Energy. The government has certain rights in the invention.