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Apparatuses and methods for removal of ink buildup

United States Patent

March 12, 2013
View the Complete Patent at the US Patent & Trademark Office
A substrate patterning method including the steps of spraying ink on a surface of a substrate, the spraying of the ink resulting in an overspray of excess ink past an edge of the substrate; changing a temperature of the excess ink to cause a change in a viscosity of the excess ink; and removing the excess ink having the changed viscosity.
Cudzinovic; Michael (Sunnyvale, CA), Pass; Thomas (San Jose, CA), Rogers; Rob (Santa Clara, CA), Sun; Ray-Hon (Palo Alto, CA), Sun; Sheng (Foster City, CA), Wahlstrom; Ben (Albany, OR), Fuhrman; Dennis Jason (Corvallis, OR), Altendorf; Kyle David (Corvallis, OR)
SunPower Corporation (San Jose, CA)
12/ 862,086
August 24, 2010
GOVERNMENT FUNDING The invention described herein was made with Governmental support under contract number DE-FC36-07GO17043 awarded by the United States Department of Energy. The Government may have certain rights in the invention.