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Rapid thermal processing by stamping

United States Patent

March 5, 2013
View the Complete Patent at the US Patent & Trademark Office
National Renewable Energy Laboratory - Visit the NREL Technology Transfer Website
A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.
Stradins; Pauls (Golden, CO), Wang; Qi (Littleton, CO)
Alliance for Sustainable Energy, LLC (Golden, CO)
12/ 675,117
August 31, 2007
CONTRACTUAL ORIGIN The United States Government has rights in this invention pursuant to Contract No. DE-AC36-99G010337 between the United States Department of Energy and the National Renewable Energy Laboratory, a Division of the Midwest Research Institute.