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Apparatus and method for rapid cooling of large area substrates in vacuum

United States Patent

8,302,554
November 6, 2012
View the Complete Patent at the US Patent & Trademark Office
National Renewable Energy Laboratory - Visit the NREL Technology Transfer Website
Apparatus and Method for Rapid Cooling of Large Area Substrates in Vacuum
The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.
Barth; Kurt L. (Fort Collins, CO), Enzenroth; Robert A. (Fort Collins, CO), Sampath; Walajabad S. (Fort Collins, CO)
Colorada State University Research Foundation. (Ft. Collins, CO)
12/ 861,391
20100314076
August 23, 2010
STATEMENT REGARDING FEDERAL RIGHTS This invention was made with government support under grant number DE-AC36-99GO10337, awarded by the Department of Energy. The government has certain rights in the invention. GOVERNMENT SUPPORT This invention was made with Government support under grants awarded by the National Renewable Energy Laboratory. The Government has certain rights in this invention.