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Low inductance power electronics assembly

United States Patent

8,279,620
October 2, 2012
View the Complete Patent at the US Patent & Trademark Office
A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
Herron; Nicholas Hayden (Redondo Beach, CA), Mann; Brooks S. (Redondo Beach, CA), Korich; Mark D. (Chino Hills, CA), Chou; Cindy (Lakewood, CA), Tang; David (Fontana, CA), Carlson; Douglas S. (Hawthorne, CA), Barry; Alan L. (Torrance, CA)
GM Global Technology Operations LLC (Detroit, MI)
12/ 632,067
December 7, 2009
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under DE-FC26-07NT43123, awarded by the U.S. Department of Energy. The Government has certain rights in this invention.