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Sub-micron decal transfer lithography

United States Patent

August 28, 2012
View the Complete Patent at the US Patent & Trademark Office
The present invention provides a method of sub-micron decal transfer lithography. The method includes forming a first pattern in a surface of a first silicon-containing elastomer, bonding at least a portion of the first pattern to a substrate, and etching a portion of at least one of the first silicon-containing elastomer and the substrate.
Heejoon; Ahn (Seoul, KR), Nuzzo; Ralph (Champaign, IL), Shim; Anne (Plaistow, NH)
Dow Corning Corporation (Midland, MI)
11/ 911,787
May 5, 2006
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This application was partially supported by the Department of Energy (DEFG02-91-ER-45439).