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Inverter power module with distributed support for direct substrate cooling

United States Patent

8,248,809
August 21, 2012
View the Complete Patent at the US Patent & Trademark Office
Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.
Miller; David Harold (San Pedro, CA), Korich; Mark D. (Chino Hills, CA), Ward; Terence G. (Redondo Beach, CA), Mann; Brooks S. (Redondo Beach, CA)
GM Global Technology Operations LLC (Detroit, MI)
12/ 198,723
August 26, 2008
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The United States government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided by the terms of DE-FC26-07NT43123 awarded by the United States Department of Energy.