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Die singulation method and package formed thereby

United States Patent

August 7, 2012
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the substrate. Deep Reactive Ion Etching (DRIE) etching of a trench through the substrate from the bottom side defines a shape for each die. A handle wafer is then attached to the bottom side of the substrate, and the sacrificial layer is etched to singulate the die and to form a frame from the retainer and the substrate. The frame and handle wafer, which retain the singulated die in place, can be attached together with a clamp or a clip and to form a package for the singulated die. One or more stops can be formed from the device layer(s) to limit a sliding motion of the singulated die.
Anderson; Robert C. (Tucson, AZ), Shul; Randy J. (Albuquerque, NM), Clews; Peggy J. (Tijeras, NM), Baker; Michael S. (Albuquerque, NM), De Boer; Maarten P. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
12/ 758,833
April 13, 2010
GOVERNMENT RIGHTS This invention was made with Government support under Contract No. DE-AC 04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.