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Solid state lighting component

United States Patent

July 10, 2012
View the Complete Patent at the US Patent & Trademark Office
An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
Yuan; Thomas (Ventura, CA), Keller; Bernd (Santa Barbara, CA), Ibbetson; James (Santa Barbara, CA), Tarsa; Eric (Goleta, CA), Negley; Gerald (Durham, NC)
Cree, Inc. (Goleta, CA)
12/ 883,979
September 16, 2010
This invention was made with Government support under Contract No. DE-DE-FC26-06NT42932 awarded by the National Energy Technology Laboratory. The Government has certain rights in this invention.