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Power electronics substrate for direct substrate cooling

United States Patent

May 1, 2012
View the Complete Patent at the US Patent & Trademark Office
Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.
Le; Khiet (Mission Viejo, CA), Ward; Terence G. (Redondo Beach, CA), Mann; Brooks S. (Redondo Beach, CA), Yankoski; Edward P. (Corona, CA), Smith; Gregory S. (Woodland Hills, CA)
GM Global Technology Operations LLC (Detroit, MI)
12/ 638,683
December 15, 2009
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under DE-FC26-07NT43123, awarded by the United States Department of Energy. The Government has certain rights in this invention.