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Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages

United States Patent

8,081,473
December 20, 2011
View the Complete Patent at the US Patent & Trademark Office
A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader. A thermally conductive support structure supports the heat conduit and thermally communicates with the heat transfer assemblies via the heat spreader transferring heat to the fluid of the heat conduit from the support structure.
Cipolla; Thomas M. (Katonah, NY), Colgan; Evan George (Chestnut Ridge, NY), Coteus; Paul W. (Yorktown Heights, NY), Hall; Shawn Anthony (Pleasantville, NY), Tian; Shurong (Mount Kisco, NY)
International Business Machines Corporation (Armonk, NY)
12/ 185,520
20100025010
August 4, 2008
This invention was made with Government support under Contract No.: B554331 awarded by Department of Energy. The Government has certain rights in this invention.