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Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

United States Patent

July 12, 2011
View the Complete Patent at the US Patent & Trademark Office
Argonne National Laboratory - Visit the Technology Development and Commercialization Website
An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.
Lin; YuPo J. (Naperville, IL), Henry; Michael P. (Batavia, IL), Snyder; Seth W. (Lincolnwood, IL)
UChicago Argonne, LLC (Chicago, IL)
12/ 288,554
October 21, 2008
CONTRACTUAL ORIGIN OF THE INVENTION The United States Government has rights in this invention pursuant to Contract No. W-31-109-ENG-38 between the U.S. Department of Energy (DOE) and The University of Chicago representing Argonne National Laboratory.