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Microcantilever heater-thermometer with integrated temperature-compensated strain sensor

United States Patent

April 19, 2011
View the Complete Patent at the US Patent & Trademark Office
The present invention provides microcantilever hotplate devices which incorporate temperature compensating strain sensors. The microcantilever hotplate devices of the present invention comprise microcantilevers having temperature compensating strain sensors and resistive heaters. The present invention also provides methods for using a microcantilever hotplate for temperature compensated surface stress measurements, chemical/biochemical sensing, measuring various properties of compounds adhered to the microcantilever hotplate surface, or for temperature compensated deflection measurements.
King; William P. (Champaign, IL), Lee; Jungchul (Champaign, IL), Goericke; Fabian T. (Wolfsburg, DE)
The Board of Trustees of the University of Illinois (Urbana, IL)
11/ 950,029
December 4, 2007
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under Subcontract No. B552749 to the Regents of the University of California and Georgia Tech Research Corporation under United States Government Prime Contract No. W-7405-RNG-48 represented by the Department of Energy National Nuclear Security Administration (DOE/NNSA) for the management and operation of Lawrence Livermore National Laboratory (LLNL). The government has certain rights in the invention.