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Structures for dense, crack free thin films

United States Patent

March 8, 2011
View the Complete Patent at the US Patent & Trademark Office
Lawrence Berkeley National Laboratory - Visit the Technology Transfer and Intellectual Property Management Department Website
The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.
Jacobson; Craig P. (Lafayette, CA), Visco; Steven J. (Berkeley, CA), De Jonghe; Lutgard C. (Lafayette, CA)
The Regents of the University of California (Oakland, CA)
11/ 567,056
December 5, 2006
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under Grant (Contract) No. DE-AC03-76F00098 awarded by The United States Department of Energy. The government has certain rights to this invention.