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Processing a printed wiring board by single bath electrodeposition

United States Patent

7,846,317
December 7, 2010
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Meltzer; Michael P. (Oakland, CA), Steffani; Christopher P. (Livermore, CA), Gonfiotti; Ray A. (Livermore, CA)
Lawrence Livermore National Security, LLC (Livermore, CA)
10/ 373,350
20030150742
February 24, 2003
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.