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Bonded semiconductor substrate

United States Patent

July 13, 2010
View the Complete Patent at the US Patent & Trademark Office
National Renewable Energy Laboratory - Visit the NREL Technology Transfer Website
Ge/Si and other nonsilicon film heterostructures are formed by hydrogen-induced exfoliation of the Ge film which is wafer bonded to a cheaper substrate, such as Si. A thin, single-crystal layer of Ge is transferred to Si substrate. The bond at the interface of the Ge/Si heterostructures is covalent to ensure good thermal contact, mechanical strength, and to enable the formation of an ohmic contact between the Si substrate and Ge layers. To accomplish this type of bond, hydrophobic wafer bonding is used, because as the invention demonstrates the hydrogen-surface-terminating species that facilitate van der Waals bonding evolves at temperatures above C. into covalent bonding in hydrophobically bound Ge/Si layer transferred systems.
Atwater, Jr.; Harry A. (South Pasadena, CA), Zahler; James M. (Pasadena, CA)
California Institute of Technology (Pasadena, CA)
11/ 430,160
May 9, 2006
FEDERAL SUPPORT STATEMENT This invention was made with government support under Contract No. DE-AC36-99G010337, Midwest Research Institute Subcontract No. ACQ-1-30619-13 awarded by the Department of Energy. The government has certain rights in the invention