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Apparatus and method for electroforming high aspect ratio micro-parts

United States Patent

October 27, 2009
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.
Hachman; John T. (Stockton, CA), Losey; Matthew W. (Rancho Cucamonga, CA), McLean; Dorrance E. (Manteca, CA)
Sandia Corporation (Livermore, CA)
11/ 599,766
November 14, 2006
STATEMENT OF GOVERNMENT SUPPORT The United States Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy to Sandia Corporation.