An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.
STATEMENT OF GOVERNMENT SUPPORT
This invention was made with government support under grant no DE-FG02-03ER83768, awarded by the Department of Energy. The government has certain rights in the invention.