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Devices using resin wafers and applications thereof

United States Patent

March 24, 2009
View the Complete Patent at the US Patent & Trademark Office
Argonne National Laboratory - Visit the Technology Development and Commercialization Website
Devices incorporating a thin wafer of electrically and ionically conductive porous material made by the method of introducing a mixture of a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material into a mold. The mixture is subjected to temperatures in the range of from about C. to about C. at pressures in the range of from about 0 to about 500 psig for a time in the range of from about 1 to about 240 minutes to form thin wafers. Devices include electrodeionization and separative bioreactors in the production of organic and amino acids, alcohols or esters for regenerating cofactors in enzymes and microbial cells.
Lin; YuPo J. (Naperville, IL), Henry; Michael P. (Batavia, IL), Snyder; Seth W. (Lincolnwood, IL), St. Martin; Edward (Libertyville, IL), Arora; Michelle (Woodridge, IL), de la Garza; Linda (Woodridge, IL)
Uchicago Argonne, LLC (Chicago, IL)
11/ 082,469
March 17, 2005
CONTRACTUAL ORIGIN OF THE INVENTION The United States Government has rights in this invention pursuant to Contract No. W-31-109-ENG-38 between the U.S. Department of Energy (DOE) and The University of Chicago representing Argonne National Laboratory.