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Methods and systems for rapid prototyping of high density circuits

United States Patent

September 2, 2008
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.
Palmer; Jeremy A. (Albuquerque, NM), Davis; Donald W. (Albuquerque, NM), Chavez; Bart D. (Albuquerque, NM), Gallegos; Phillip L. (Albuquerque, NM), Wicker; Ryan B. (El Paso, TX), Medina; Francisco R. (El Paso, TX)
Sandia Corporation (Albuquerque, NM)
10/ 907,979
April 22, 2005
GOVERNMENT INTEREST STATEMENT This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Department of Energy has certain rights to this invention.