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Method for bonding a transmission line to a downhole tool

United States Patent

7,291,303
November 6, 2007
View the Complete Patent at the US Patent & Trademark Office
An apparatus for bonding a transmission line to the central bore of a downhole tool includes a pre-formed interface for bonding a transmission line to the inside diameter of a downhole tool. The pre-formed interface includes a first surface that substantially conforms to the outside contour of a transmission line and a second surface that substantially conforms to the inside diameter of a downhole tool. In another aspect of the invention, a method for bonding a transmission line to the inside diameter of a downhole tool includes positioning a transmission line near the inside wall of a downhole tool and placing a mold near the transmission line and the inside wall. The method further includes injecting a bonding material into the mold and curing the bonding material such that the bonding material bonds the transmission line to the inside wall.
Hall; David R. (Provo, UT), Fox; Joe (Spanish Fork, UT)
IntelliServ, Inc. (Provo, UT)
10/ 707,673
20070169929
December 31, 2003
FEDERAL RESEARCH STATEMENT This invention was made with government support under Contract No. DE-FC26-01NT41229 awarded by the U.S. Department of Energy. The government has certain rights in the invention.