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Doped Y.sub.2O.sub.3 buffer layers for laminated conductors

United States Patent

August 21, 2007
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
A laminated conductor includes a metallic substrate having a surface, a biaxially textured buffer layer supported by the surface of the metallic substrate, the biaxially textured buffer layer comprising Y.sub.2O.sub.3 and a dopant for blocking cation diffusion through the Y.sub.2O.sub.3, and a biaxially textured conductor layer supported by the biaxially textured buffer layer.
Paranthaman; Mariappan Parans (Knoxville, TN), Schoop; Urs (Westborough, MA), Goyal; Amit (Knoxville, TN), Thieme; Cornelis Leo Hans (Westborough, MA), Verebelyi; Darren T. (Oxford, MA), Rupich; Martin W. (Framingham, MA)
UT-Battelle, LLC (Oak Ridge, TN), American Superconductor (Westborough, MA)
11/ 192,488
July 29, 2005
The United States Government has rights in this invention pursuant to contract no. DE-AC05-00OR22725 between the United States Department of Energy and UT-Battelle, LLC.