Skip to Content
Find More Like This
Return to Search

Wafer bonded virtual substrate and method for forming the same

United States Patent

July 3, 2007
View the Complete Patent at the US Patent & Trademark Office
National Renewable Energy Laboratory - Visit the NREL Technology Transfer Website
A method of forming a virtual substrate comprised of an optoelectronic device substrate and handle substrate comprises the steps of initiating bonding of the device substrate to the handle substrate, improving or increasing the mechanical strength of the device and handle substrates, and thinning the device substrate to leave a single-crystal film on the virtual substrate such as by exfoliation of a device film from the device substrate. The handle substrate is typically Si or other inexpensive common substrate material, while the optoelectronic device substrate is formed of more expensive and specialized electro-optic material. Using the methodology of the invention a wide variety of thin film electro-optic materials of high quality can be bonded to inexpensive substrates which serve as the mechanical support for an optoelectronic device layer fabricated in the thin film electro-optic material.
Atwater, Jr.; Harry A. (So. Pasadena, CA), Zahler; James M. (Pasadena, CA), Morral; Anna Fontcuberta i (Paris, FR)
California Institute of Technology (Pasadena, CA)
10/ 761,918
January 20, 2004
FEDERAL SUPPORT STATEMENT This invention was made with government support under Contract No. DE-AC36-99G010337, Midwest Research Institute Subcontract No. ACQ-1-30619-13 awarded by the Department of Energy and Contract No. NAS3-02201, Subcontract No. 200492; LEW-17946-1 awarded by NASA. The government has certain rights in the invention.