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Composite patterning devices for soft lithography

United States Patent

March 27, 2007
View the Complete Patent at the US Patent & Trademark Office
The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
Rogers; John A. (Champaign, IL), Menard; Etienne (Urbana, IL)
The Board of Trustees of the University of Illinois (Urbana, IL)
11/ 115,954
April 27, 2005
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support awarded by Department of Energy Grant DEFG02-91ER45439. The United States Government has certain rights in this invention.