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Method of defining features on materials with a femtosecond laser

United States Patent

May 23, 2006
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
The invention relates to a pulsed laser ablation method of metals and/or dielectric films from the surface of a wafer, printed circuit board or a hybrid substrate. By utilizing a high-energy ultra-short pulses of laser light, such a method can be used to manufacture electronic circuits and/or electro-mechanical assemblies without affecting the material adjacent to the ablation zone.
Roos; Edward Victor (Los Altos, CA), Roeske; Franklin (Livermore, CA), Lee; Ronald S. (Livermore, CA), Benterou; Jerry J. (Livermore, CA)
The Regents of the University of California (Oakland, CA)
10/ 704,459
November 7, 2003
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.