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Pin-deposition of conductive inks for microelectrodes and contact via filling

United States Patent

May 2, 2006
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.
Davidson; J. Courtney (Livermore, CA), Krulevitch; Peter A. (Pleasanton, CA), Maghribi; Mariam N. (Livermore, CA), Hamilton; Julie K. (Tracy, CA), Benett; William J. (Livermore, CA), Tovar; Armando R. (San Antonio, TX)
The Regents of the University of California (Oakland, CA)
10/ 742,112
December 18, 2003
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.